利用離心資源之真空裝置Vacuum Device by Using Centrifugal Resources

專利類型

發明

專利國別 (專利申請國家)

中華民國

專利申請案號

100110228

專利證號

I 500482

專利獲證名稱

利用離心資源之真空裝置Vacuum Device by Using Centrifugal Resources

專利所屬機關 (申請機關)

國立清華大學

獲證日期

2015/09/21

技術說明

本發明提供一種晶圓研磨系統及其晶圓吸附裝置，其 係將至少一中空管設置於晶圓吸附裝置之圓盤內，並將中 空管之一端暴露於圓盤之下緣，另一端暴露於其側緣。當 研磨頭旋轉時，此中空管可利用研磨頭轉動所自然產生的 離心力，由圓盤下緣抽取晶圓與圓盤間的氣體及/或液體， 並由圓盤之側緣排放至外界環境中，藉以產生真空。倘若 在圓盤與晶圓間存在少量氣體或液體，則中空管及離心力 將持續吸取殘存於其中的氣體/液體，以維持真空並吸附晶 圓。上述殘存於圓盤及晶圓間的氣體/液體即為破片問題的 主要原因。 The present invention provides a wafer holding vacuum for a wafer polishing system and the wafer suction device for CMP (Chemical Mechanical Polishing) by utilizing existing resources provided by the rotating polishing head. The device introduces a channel configured in the wafer suction device. One end of the channel is exposed at downside of the holding block, and another end of the tube is exposed at lateral side of the holding block. By aforementioned configuration, the channel can inhale gas and/or liquid between the wafer and the device at the downside, and can exhale them to the outer circumstance at the lateral side using centrifugal force naturally provided by the polishing head. When the CMP is polishing the wafer, due to turning and vibrating air and liquid occasionally ship into the contact between the holding block and the back side of the wafer causing the holding block unable to hold the wafer firmly. This is the main cause for wafer to get loose and break out.

備註

本部(收文號1090057669)同意該校109年9月15日清智財字第1099006426號函申請終止維護專利(清華大學)

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