聚苯噁/黏土奈米複合材料的製造方法

專利類型

發明

專利國別 (專利申請國家)

美國

專利申請案號

10/316,214

專利證號

US 7,081,491 B2

專利獲證名稱

聚苯噁/黏土奈米複合材料的製造方法

專利所屬機關 (申請機關)

國立成功大學

獲證日期

2006/07/25

技術說明

本發明利用有機黏土和高性能的聚苯噁唑(polybenzoxazole, PBO) 製成PBO/黏土奈米複合材料。 X-光繞射分析和穿透式電子顯微鏡 (TEM)分析均顯示有機黏土在PBO中呈現奈米分散。Thermal Mechanical Analysis(TMA) 分析發現PBO/黏土奈米複合材料的熱膨 脹係數隨黏土的添加量的增加而減少，添加 7 % 黏土的複合材料， 其熱膨脹係數降低21 %。由微差掃瞄卡計分析(DSC)及熱重量分析 (TGA)均顯示PBO/黏土奈米複合材料的玻璃轉移溫度(Tg)及熱裂解溫 度隨黏土的添加量的增加而增加，添加 7 % 黏土的複合材料其熱裂 解溫度增加12 oC，而Tg增加16 oC。利用此項技術，可製成高耐熱 性，高機械強度，低熱膨脹係數，低吸水性，低介電常數的高分子 材料。 A novel polybenzoxazole (PBO)/clay nanocomposite has been prepared from a PBO precursor, polyhydroxyamide(PHA), and an organoclay. Both x-ray diffraction (XRD) and transmission electron microscope (TEM) analyses showed the organoclay was dispersed in PBO matrix in a nanosacle. The in-plane coefficient of thermal expansion (CTE) of PBO/clay film was decreased with the amount of organoclay. The CTE of PBO/clay film containing 7 wt % clay was decreased 21 % compared to pure PBO film. Both of the glass transition temperature (Tg) and the thermal decomposition temperature of PBO/clay were increased with the amount of organoclay. The thermal decomposition temperature and the Tg of PBO/clay containing 7 wt % clay were increased 12 oC and 16 oC respectively. A high performance polymeric material with high temperature stability, high mechanical properties, low coefficient of thermal expansion, low water absorption, and low dielectric constant can be prepared by using this technology.

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