具有輔助極板之雷射加工裝置

專利類型

發明

專利國別 (專利申請國家)

中華民國

專利申請案號

102101445

專利證號

I 485024

專利獲證名稱

具有輔助極板之雷射加工裝置

專利所屬機關 (申請機關)

國立雲林科技大學

獲證日期

2015/05/21

技術說明

本發明之目的，在於提供一種具有輔助極板之雷射加工裝置，其兼具可提高電場強度、可吸附更大的熔渣、可降低電漿遮蔽效應、提升雷射鑽孔偵測訊號與可直接應用於現有裝置上等優點。特別是，本發明所欲解決之問題係在於電漿遮蔽效應造成雷射加工效率降低與偵測訊號中和抵消等問題。先前技術乃是用純金屬電極來進行偵測。大多著重於電漿偵測並未用在輔助雷射加工。本技術則以指叉型電極來進行偵測與輔助加工‚大大提升偵測靈敏度與輔助加工效率。 The purpose of the invention is to provide a laser machining device with assisted electrodes. It increases the electric field strength between the electrodes, attracts larger particles in plume, reduces plasma shielding effect, and increases the level of drilling monitoring signal. Previously, the assisted plane electrodes were for plasma detection, but not for the assistance in laser machining. In this invention, the interdigital electrodes can be used for both the plasma detection as well as the assistance in laser machining. The invention provides a high detection sensitivity and better machining efficiency.

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