具有天線之封裝結構及其天線

專利類型

發明

專利國別 (專利申請國家)

中華民國

專利申請案號

100123577

專利證號

I 492448

專利獲證名稱

具有天線之封裝結構及其天線

專利所屬機關 (申請機關)

國立中山大學

獲證日期

2015/07/11

技術說明

一種具有天線之封裝結構，係包含：一載板單元，係包含一基板、一介質體及一載板接地部，該基板設置該介質體及該載板接地部；一天線單元，係於上述載板單元之介質體內設置一饋入導體、一輻射導體及一接地導體，該饋入導體形成一分岔端，該輻射導體耦合該分岔端，該接地導體電性連接該饋入導體及上述載板單元之載板接地部；及至少一電路單元，係設置於上述載板單元之介質體外，並電性連接上述天線單元之饋入導體及接地導體。一種天線，係應用於封裝結構，該天線包含：一饋入導體耦合一輻射導體，一接地導體電性連接該饋入導體。 A packaging structure with an antenna is disclosed. The packaging structure comprises a carrier unit, an antenna unit ant at least one circuit unit. The carrier unit includes a substrate installing a medium and a carrier ground. The antenna unit includes a fed¬in conductor forming into a fork end coupled with the radiation conductor, with the ground conductor electrically connecting to the fed¬in conductor and the carrier ground of the carrier unit. The circuit unit arranges on the medium of the carrier unit and electrically connects the fed¬in conductor and the ground conductor of the antenna unit. An antenna applied in a packaging structure includes a fed¬in conductor, a radiation conductor and a ground conductor. The fed¬in conductor is coupled with the radiation conductor. The ground conductor electrically connects to the fed¬in conductor.

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