具有高導熱效果的發光二極體陣列封裝結構

專利類型

發明

專利國別 (專利申請國家)

中華民國

專利申請案號

108117755

專利證號

I 696302

專利獲證名稱

具有高導熱效果的發光二極體陣列封裝結構

專利所屬機關 (申請機關)

國立臺灣科技大學

獲證日期

2020/06/11

技術說明

一種具有高導熱效果的發光二極體陣列封裝結構，包括一封裝基板、一發光二極體陣列、一高導熱色轉換層及一透明導熱基板。高導熱色轉換層由透明膠材、螢光粉及透明陶瓷填充物混合而成，直接填充於發光二極體陣列及其封裝基板上。透明導熱基板直接接觸於高導熱色轉換層的上表面。一部分的透明陶瓷填充物與封裝基板接觸，而另一部分則與透明導熱基板接觸。因此高導熱色轉換層本身由於顏色轉換時所產生的輻射熱與傳導熱，或是受發光二極體晶片產生的傳導熱，皆可經由透明導熱基板或封裝基板移除，因此可提高白光輸出，並適合搭配高分子光學元件以減少眩光，並提高發光效率。 A light emitting diode (LED) array package structure with high thermal conductivity includes a package substrate, a light emitting diode array, a high thermal conductive color conversion layer and a transparent ceramic substrate. The high thermal conductive color conversion layer is made of a mixture of transparent optical resin, phosphor powder and transparent ceramic filler, and is directly dispensed on the LED array and the package substrate. The transparent ceramic substrate is in direct contact with the upper surface of the high thermal conductive color conversion layer. A portion of the transparent ceramic filler contacts the package substrate while another portion is in contact with the transparent ceramic substrate. The conduction and radiation heat generated by the high thermal conductive color conversion layer itself due to color conversion, and the conductive heating caused by the LED chips, both can be removed through either the package substrate or the transparent ceramic substrate, thereby improving the white light output power and being suitable for implementing with polymeric optical components to reduce glare and enhance luminous efficiency.

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