立型連續式濺鍍設備之基板傳輸裝置

專利類型

發明

專利國別 (專利申請國家)

中華民國

專利申請案號

096142951

專利證號

I 356854

專利獲證名稱

立型連續式濺鍍設備之基板傳輸裝置

專利所屬機關 (申請機關)

修平學校財團法人修平科技大學

獲證日期

2012/01/21

技術說明

本發明所欲解決的問題在於提供一種磁控基板非接觸式垂直姿態傳輸，可以提升鍍膜良率及設備稼動率的立型連續式濺鍍設備之基板傳輸裝置。 為解決上述問題，本發明所述的立型連續式濺鍍設備之基板傳輸裝置，係提出在真空腔體下方設置傳輸動力單元，基板係由金屬載具所搭載，且載具的底端係與傳輸動力單元接觸以傳輸基板前進；另外，至少一組磁性元件分別設置在相對於基板的兩側的腔體內側面，而相對應的磁性元件之磁性大小相同，且磁性元件可以為永久磁鐵或電磁鐵；由於載具係導電金屬材質，而可藉相對應磁性元件對玻璃基板的非接觸式磁力作用，使搭載基板的載具維持穩定垂直姿態傳輸而不產生傾斜晃動，達到可同時對基板進行雙面鍍膜。 Sputtering vacuum deposition has been seen in TFT-LCD industry and is known a critical process. In the manufacturing process of LCD devices, it is necessary to reduce waste, automate operations and increase availability in order to efficiently form ITO transparent conductive films, metal electrode wiring films, insulating films, etc. The vertical in-line sputtering equipment has been developed to meet these requirements. The equipment can process a large amount of large-scale substrates by transferring two trays and simultaneously forming film on each side of the trays. The unit-type loading chamber and sputter chamber make it possible to flexibly configure the equipment according to the production scale. One of the critical components in vertical in-line sputtering system equipment is the transmission that dominates the thin film property and deposition efficiency.

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