熱膨脹係數檢測系統及方法

專利類型

發明

專利國別 (專利申請國家)

中華民國

專利申請案號

107128061

專利證號

I 676025

專利獲證名稱

熱膨脹係數檢測系統及方法

專利所屬機關 (申請機關)

國立中山大學

獲證日期

2019/11/01

技術說明

一種熱膨脹係數檢測系統及方法，用以解決習知熱膨脹係數檢測方法無法達到即時性檢測的問題。係包含:一測試件，具有一檢測樣本及一基板;一測量模組，電性連接該測試件，該量測模組用以產生一加熱電流進入該檢測樣本並維持一加熱時間，及在該檢測樣本與該基板之間施加一電位差並測量一電容值;及一資料處理模組，耦合連接該測量模組，該資料處理模組藉由分析該加熱電流、該加熱時間、該電位差及該電容值、得到一極限電流值及一穩定時間、及該檢測樣本與該基板之間的一吸附電壓值、再導入一經驗公式計算出該檢測樣本的熱膨脹係數。 A system and a method for measuring a thermal expansion coefficient are provided to solve the problem where the conventional measuring method cannot provide a real-time measuring. The system includes a test member having a tested sample and a substrate, a measuring module generating a heating current flowing into the tested sample which remains a period of time, and a data processing module coupled with the measuring module. The measuring module applies a voltage difference between the tested sample and the substrate and measures a capacitance value. The data processing module obtains a limited current value, a stable time and an absorption voltage value which between the tested sample and the substrate by analyzing the heating current, the heating time, the voltage difference and the capacitance value. The data processing module introduces an equation to calculate the thermal expansion coefficient of the tested sample.

備註

本會(收文號1120039878)同意該校112年6月28日中產營字第1121400592號函申請終止維護專利(國立中山大學)

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