用於製造導電結構的反應墨水以及製造導電結構的方法REACTIVE INK FOR FORMING CONDUCTIVE STRUCTURE AND METHOD OF MAKING CONDUCTIVE STRUCTURE

專利類型

發明

專利國別 (專利申請國家)

中華民國

專利申請案號

103140279

專利證號

I 529223

專利獲證名稱

用於製造導電結構的反應墨水以及製造導電結構的方法REACTIVE INK FOR FORMING CONDUCTIVE STRUCTURE AND METHOD OF MAKING CONDUCTIVE STRUCTURE

專利所屬機關 (申請機關)

國立中興大學

獲證日期

2016/04/11

技術說明

一種用於製造導電結構的反應墨水，包含有一金屬錯離子溶液以及一具有至少兩個羥基官能基的醇類溶劑，該金屬錯離子溶液與該醇類溶劑的體積比範圍為9：1～1：9。本發明還有關一種製造導電結構的方法，其包含有使本發明之反應墨水與一基板的表面接觸，該反應墨水與該基板至少其中之一具有透光性；將一雷射光束照射至該反應墨水或該基板，使該反應墨水中的金屬錯離子還原成附著於該基板表面的元素態金屬，以於該基板表面形成一導電結構；以及移除該基板表面剩餘的反應墨水等步驟。 A reactive ink for forming conductive structure includes a metal complex ion solution and an alcoholic solvent having at least two hydroxyl groups. A volumetric ratio of the metal complex ion solution to the alcoholic solvent ranges between 9:1 and 1:9. A method of making conductive structure is also disclosed, including the steps of contacting the reactive ink with a surface of a substrate, wherein at least one of the reactive ink and the substrate has light transmission; reducing the metal ion contained in the reactive ink to elemental metal to form a conductive structure on the surface of the substrate by emitting a laser beam to the reactive ink or the substrate; and removing the residual reactive ink from the surface of the substrate.

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