感測器及其製造方法

專利類型

發明

專利國別 (專利申請國家)

中華民國

專利申請案號

105105605

專利證號

I 612300

專利獲證名稱

感測器及其製造方法

專利所屬機關 (申請機關)

國立清華大學

獲證日期

2018/01/21

技術說明

本發明提供一種感測器及其製造方法，其可整合晶片於高分子基板中，以降低製造成本，進而提升商業產品競爭力。本發明包括以下步驟：提供具有模穴的模具。於模穴中配置至少一晶片。晶片具有相對的主動面與背面。主動面朝向模穴的底面。將高分子材料填入模穴中，以覆蓋晶片的背面。進行熱處理，使得高分子材料固化為高分子基板。進行脫模處理，使得高分子基板從模穴分離出來。於高分子基板的第一表面上形成多條導線。導線與晶片電性連接。 Provided is a manufacturing method of a sensor including the following steps. A mold having a cavity is provided. At least one chip is disposed in the cavity. The chip has an active surface and a back surface opposite to each other. The active surface faces toward a bottom surface of the cavity. A polymer material is filled in the cavity to cover the back surface of the chip. A heat treatment is performed, such that the polymer material is solidified to form a polymer substrate. A mold release process is performed to isolate the polymer substrate from the cavity. A plurality of the conductive lines are formed on a first surface of the polymer substrate. The conductive lines are electrically connected with the chip.

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