整合電子元件之多層線路織物材料

專利類型

發明

專利國別 (專利申請國家)

中華民國

專利申請案號

106128896

專利證號

I 629760

專利獲證名稱

整合電子元件之多層線路織物材料

專利所屬機關 (申請機關)

國立臺北科技大學

獲證日期

2018/07/11

技術說明

1.導電紗線： 利用具備導電能力的纖維(金屬纖維或塗佈介面導電層)，整合特殊織布技術，將導電紗線織入布料內，使用特殊的製程設備方式與改良的織布方法。2.導電漿料：在布料基材上的電子訊號，能傳遞或接收至一般電子業所熟悉的電子基材上，進而轉化成電子訊號來做處理，藉由導電漿料之材料選擇結合電子業之製程方式於紡織業中，將布料上的電子訊號，傳遞到軟性電路板(FPC)而能進一步做電子運算，且不損傷耐溫性低，機械性能較弱的布材。以上兩種技術皆可通過電子與紡織業相關檢驗規範 1.Conductive textile: the use of conductive capacity of fiber (metal fiber or coated interface conductive layer), the integration of special weaving technology, the conductive yarn woven into the fabric, the use of special process equipment and improved weaving method The 2. conductive paste: the electronic material on the fabric substrate can be transmitted or received to the general electronic industry is familiar with the electronic substrate, and then converted into electronic signals to do the processing, by means of conductive material selection of electronic materials The process of the industry in the textile industry, the fabric of the electronic signal, passed to the soft circuit board (FPC) and can do further electronic computing, does not damage the low temperature resistance, mechanical properties of the weak cloth. The above two technologies can be through the electronic and textile industry test specification.

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