熱導元件內部空隙率的量測系統與其量測方法

專利類型

發明

專利國別 (專利申請國家)

中華民國

專利申請案號

110108497

專利證號

I 768756

專利獲證名稱

熱導元件內部空隙率的量測系統與其量測方法

專利所屬機關 (申請機關)

國立臺灣大學

獲證日期

2022/06/21

技術說明

一種熱導元件內部空隙率的量測系統，用以量測一熱導元件，包括：一加熱裝置，作為熱源以加熱所述熱導元件的蒸發端；一冷卻裝置，以冷卻所述熱導元件的冷凝端；至少一對電極片，分別貼附於所述熱導元件的兩相對表面；以及一阻抗測試計，電連接於所述至少一對電極片以量測所述熱導元件的阻抗。每一阻抗轉換為相對應於所述熱導元件受量測位置的空隙率。本發明還提供一種熱導元件內部空隙率的量測方法。A system for measuring an internal voidage of a thermal conduction member includes a heating device, a cooling device, at least one pair of electrode pads, and a LCR meter. The heating device is a heat source to heat an evaporating end of the thermal conduction member. The cooling device is used to cool a condensing end of the thermal conduction member. The least one pair of electrode pads are respectively attached to two opposite surface of the thermal conduction member. The LCR meter is electrically connected to the least one pair of electrode pads to measure the impedance of the thermal conduction member. Each impedance is transferred to an internal voidage which is corresponded to a measured position of the thermal conduction member. Further, a method for measuring an internal voidage of a thermal conduction member is also provided according to the present invention.

備註

連絡單位 (專責單位/部門名稱)

產學合作總中心

連絡電話

33669945

網址