電解複合磨粒拋光裝置及其拋光方法

專利類型

發明

專利國別 (專利申請國家)

中華民國

專利申請案號

103103209

專利證號

I 550140

專利獲證名稱

電解複合磨粒拋光裝置及其拋光方法

專利所屬機關 (申請機關)

國立中山大學

獲證日期

2016/09/21

技術說明

一種電解複合磨粒拋光裝置及其拋光方法，用以穩定控制加工電流以提升拋光加工品質，該電解複合磨粒拋光裝置係包含：一承載座，該承載座具有一結合部以供結合固定一工件；一研磨墊，該研磨墊於其中一表面開設一溝槽，該表面用以與該工件相抵接，該研磨墊未開設該溝槽之位置沿著一軸向方向之高度係形成一厚度，而該溝槽沿著該軸向方向之高度則形成一深度，該厚度係大於該深度；一加工槽，用以充填一電解研磨液，該研磨墊與該工件之接觸表面係浸置於該電解研磨液當中；及一電源，分別電性連接該工件與該研磨墊遠離該溝槽之另一表面。 An electro-chemical abrasive polishing apparatus with its polishing method is used to stably control the working current, so that the polished quality can be promoted. This apparatus includes: a supporting seat with a junction to fix a work-piece; a polishing pad with one of the surfaces having the grooves to contact with this work-piece, the depth of these grooves are formed for this pad, the thickness of this pad without groove is formed on its height along the axial direction, so that this thickness is larger than this depth; a working bath is used to fill the electrolytic working fluid, so that the contact surface between this polishing pad and the work-piece is immersed into the working fluid; the power supply is connected with the surfaces of the work-piece and the polishing pad away from the grooves, respectively.

備註

本部(收文號1080052387)同意該校108年7月30日中產營字第1081400796號函所報終止維護專利。

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