高效率發光二極體製作方法MANUFACTURING METHOD OF HIGH-EFFICIENCY LED

專利類型

發明

專利國別 (專利申請國家)

美國

專利申請案號

13/366,783

專利證號

US 8,530,251 B2

專利獲證名稱

高效率發光二極體製作方法MANUFACTURING METHOD OF HIGH-EFFICIENCY LED

專利所屬機關 (申請機關)

中原大學

獲證日期

2013/09/10

技術說明

表面結構技術已被證明能有效提升發光二極體出光效率，本專利採用軟性壓印技術配合反向壓印的技術，將微/奈米結構以極微小壓力建立在曲面發光二極體晶圓表面。製作方式可先選擇抗黏合劑塗佈於軟性模具表面，以利後續脫膜製程；再將折射率介於半導體材料與空氣之間的壓印材料塗佈於軟性模具表面，並將模具與晶圓貼合，施以壓印力，這同時以紫外光或是加熱方式將材料熟化，最後將模具與晶圓脫離，完成壓印程序。以上程序中包含一些加熱製程以確保壓印材料中的有機溶劑得以適當揮發。 Surface texturing has been demonstrated to increase the light efficiency of light-emitting diode (LED). Integrating soft imprinting technology and reversal imprinting technology to build micro/nano structures on the warp LED wafer is the main issue of this patent. Anti-adhesive film is deposited on the surface of the soft mold first to reduce the friction force of the demolding process. The imprinting material which refractive index is between semiconductor and air then spun onto the soft mold. The mold and the wafer is sent to imprinting with some pressing force. Meanwhile, UV light or thermal heating is to cure the imprinting material. Finally, separating the mold and wafer to finish the imprinting procedure. During above processes, thermal heating is used to evaporate organic solvent.

備註

本部(收文號1090062346)同意該校109年10月13日原產字第1090003950號函申請終止維護專利(中原大學)

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