發明
中華民國
096132323
I 455325
金屬-半導體-金屬(MSM)型光檢測器可靠度測試方法
南臺學校財團法人南臺科技大學
2014/10/01
本發明係有關於一種金屬-半導體-金屬(MSM)型光檢測器可靠度測試方法,其實施步驟依序乃是先測定出金屬-半導體-金屬(MSM)型光檢測器之元件最小工作失效電流值,而後,將此所測得的最小工作失效電流值擷取一適當比例作為測試電流值,並依測試電流值之設定配合擷取一適當溫度,於此,藉由該調變溫度及電流的方式,便可有效得知該金屬-半導體-金屬(MSM)型光檢測器之元件於測試前、後所產生之各項數值變化,而依此數值變化之幅度,即可快速準確評估出該元件之可靠度。 The present invention relates to a method for testing reliability of a metal-semiconductor-metal photo-detector, the process of which includes detection of the minimum work failure current value from the components of the metal-semiconductor-metal photo-detector, capture of an appropriate proportion from the minimum work failure current value as a testing current value, and in turn capture of a proper temperature based on the setting of the testing current value. According to the above, the variations of each value produced before or after the testing of the component of the MSM photo-detector will be known efficiently by means of modification of the temperatures and electric currents, and the reliability of the component will be evaluated and estimated fast and exactly in accordance with the range of value variations.
本部(收文號1090060337)同意該校109年9月26日南科大研產字第1090010583號函申請終止維護專利(南台科技大學)
研究發展暨產學合作處
06-2531841
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