無探針式積體電路平行測試系統及其測試方法

專利類型

發明

專利國別 (專利申請國家)

中華民國

專利申請案號

104113553

專利證號

I 537578

專利獲證名稱

無探針式積體電路平行測試系統及其測試方法

專利所屬機關 (申請機關)

國立清華大學

獲證日期

2016/06/11

技術說明

本發明提供一種無探針式積體電路平行測試系統，其包含一IC晶片、一無線電源接收模組以及一內建自我測試電路。無線電源接收模組電性連接IC晶片及內建自我測試電路。無線電源接收模組、內建自我測試電路及IC晶片係一同被形成於一晶圓上。無線電源接收模組提供電源至內建自我測試電路及IC晶片，IC晶片於接受無線電源模組供電後，執行對應之一功能運作，並將運作結果傳送至內建自我測試電路以測試功能運作之正確性。藉此全程無線之電源供應及訊號發送方式，得以排除探針的使用，降低測試複雜度，亦可達到一次性之平行測試。 A probeless parallel test system for IC is provided. The test system includes an IC chip, a wireless power receiver and a BIST. The wireless power receiver is electrically connected to the IC chip and the BIST. The wireless power receiver, the BIST and the IC chip are formed in a wafer. The wireless power receiver provides an electrical power to the BIST and the IC chip. The IC chip performs a functional operation after receiving the electrical power, and transfers the functional operation result to the BIST for testing. The whole testing procedures for the IC chip are performed wirelessly, thus no probes are required. Moreover, the test system of the present disclosure is capable for performing a parallel test through the wireless power receiver.

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