磁控式電漿濺鍍機

專利類型

發明

專利國別 (專利申請國家)

中華民國

專利申請案號

099109191

專利證號

I 456082

專利獲證名稱

磁控式電漿濺鍍機

專利所屬機關 (申請機關)

國立中山大學

獲證日期

2014/10/11

技術說明

一種磁控式電漿濺鍍機，包含：一濺鍍腔體、一引導線圈及一磁控裝置。該濺鍍腔體具有一承載底部及一結合端部，該承載底部與該結合端部係為兩相對端部，該承載底部係供設置一被鍍物，該結合端部係供設置一靶材。該承載底部與該結合端部之間係界定形成一濺鍍空間，且一參考線係依序延伸通過該承載底部、濺鍍空間及結合端部；該引導線圈係以該濺鍍腔體之參考線為中心軸繞製而成，且該引導線圈系圍繞該濺鍍空間；該磁控裝置係設置於該濺鍍腔體具有該結合端部的一側，且該磁控裝置具有一磁化側，該磁化側係朝向該結合端部。 A magnetron sputtering apparatus comprises a sputtering cavity, a guiding coil, and a magnetization unit. The sputtering cavity has a loading portion and a supporting portion opposite to the loading portion such that a sputtering space is defined between the two portions. The loading portion and the supporting portion are respectively used for loading a substrate and supporting a target. A reference axis is also defined and passes through the loading portion, the sputtering space, and the supporting portion in order. The guiding coil is wound around the reference axis and surrounds the sputtering space. The magnetization unit is arranged at one side of the puttering cavity, and it's magnetization side is assembled facing to the supporting portion.

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