封裝結構及其製法PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

專利類型

發明

專利國別 (專利申請國家)

中華民國

專利申請案號

104122709

專利證號

I 566439

專利獲證名稱

封裝結構及其製法PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

專利所屬機關 (申請機關)

國立交通大學

獲證日期

2017/01/11

技術說明

本發明係提供兩種封裝結構，應用於一固態照明裝置中，其一至少包含一發光元件、無基板結構及移除基板製程、封膠以及複數個螢光粉體噴塗或灌滿上下層成一架體以封裝發光元件。其二至少包含一發光元件、兩橫柱作為框架取代基板、定義電極區域於橫槓上，將發光元件裝置於電極橫槓上、封膠以及複數個螢光粉體噴塗或灌滿下層成架體以封裝發光元件，且該些螢光粉體係分佈於封膠中。另外，上述封裝結構的製作方法亦揭露於本發明中。兩者皆不受基板材料吸收反射所影響，使得晶片底層可以充分的出光，不但能降低上下兩面的色均勻度差異，且由於減少了基板的影響，而能提升元件效率。 Two package structures applied for methods for a solid-state lighting apparatus is disclosed in the present invention and the one at least comprises a light emitting member, a non-substrate structure and the process, an encapsulant and a plurality of fluorescent powers to spray or filled with the up and down of the device. The another one at least comprises a light emitting member, the dual horizontal rod to replace the substrate, defining the region on the horizontal rod. The light emitting member is disposed on the region of the electrode and onto the horizontal rod. The encapsulant is provided to fill the frame for packing the light emitting member therein and under the horizontal rod, and the fluorescent powders are dispersed in the encapsulant. On the other hand, a method for manufacturing the above package structure is also disclosed in the present invention.

備註

本會(收文號1120019924)同意該校112年4月7日陽明交大研產學字第1120010771號函申請終止維護專利(國立陽明交通大學)

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