可促進傷口癒合之敷材A PATCH FOR PROMOTING WOUND HEALING

專利類型

發明

專利國別 (專利申請國家)

中華民國

專利申請案號

104116967

專利證號

I 578970

專利獲證名稱

可促進傷口癒合之敷材A PATCH FOR PROMOTING WOUND HEALING

專利所屬機關 (申請機關)

國立中山大學

獲證日期

2017/04/21

技術說明

一種可促進傷口癒合之敷材，係包含：一軟性基材，該軟性基材具有相對之一第一表面及一第二表面；一第一電極組，設於該第一表面，該第一電極組包含一第一正電極、一第一負電極、一第一導電線及一第二導電線，該第一正電極係電性連接於該第一導電線，該第一負電極係電性連接於該第二導電線；至少一放電纖維，披覆於該第一電極組，並該放電纖維以不同部位分別連接於該第一導電線及該第二導電線。本發明可促進傷口癒合之敷材，係不需另外連接笨重的電壓設備，進而可以達到增加使用便捷性之功效。 A patch for promoting wound healing, which comprises: a soft base, the soft base comprises a first surface and a second surface against to the first surface; a first electrode assembly mounted on the first surface, and the first electrode assembly comprises a first positive electrode, a first negative electrode, a first conductive wire and a second conductive wire. The first positive electrode electrically connects to the first conductive wire and the first negative electrode electrically connects to the second conductive wire. The patch for promoting wound healing also comprises at least one discharge fiber capping on the first electrode assembly, and the discharge fiber connect to the first conductive wire and the second conductive wire with different parts respectively. This invention of the patch for promoting wound healing doesn’t need to connect to a heavy voltage installation and more convenience when using.

備註

本部(收文號：第1080067117號)同意該校108年10月8日中產營字第1081401079號函通報專利終止維護案。

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