電沈積銅奈米粒子之方法METHOD FOR ELECTRODEPOSITING COPPER NANOPARTICLES

專利類型

發明

專利國別 (專利申請國家)

美國

專利申請案號

13/761,693

專利證號

US 9,272,903 B2

專利獲證名稱

電沈積銅奈米粒子之方法METHOD FOR ELECTRODEPOSITING COPPER NANOPARTICLES

專利所屬機關 (申請機關)

國立中興大學

獲證日期

2016/03/01

技術說明

本發明是於電沉積法利用導電氮化膜控制金屬奈米粒子之形貌與大小，有別於文獻上採用改變電解液之pH值及溫度、電壓與電流以及介面活性劑種類等。其特點如下： 1、利用導電氮化物膜當電極，因其具有表面形貌與方向性可調控性及極佳抗腐蝕性，其適用範圍比一般電極更加廣泛。 2、現今電沉積法大多需在酸、鹼性電解液才能達成奈米粒子形貌控制，而利用不同形貌之導電氮化物，便可在中性環保溶液中控制奈米金屬粒子的形貌與大小。 This invention is to control the shape and size of metallic nanoparticles by using conductive nitride layers with different morphologies in electrodeposition. This is different from those reported in the literature, such as changes of pH values, temperatures, current/voltage, and the types of surfactant during electrodeposition. The key points of the invention: 1. The conductive nitride layers were employed as electrodes. Because of the easy control of morphologies and orientation, as well as the excellent corrosion resistance, this invention exhibits much wider applications compared to the commercially used electrodes. 2. Conventionally, acidic or basic electrolytes were used to control the shape and size of metallic nanoparticles. The conductive nitride layers with different morphologies allow the use of neutral electrolytes in controlling the shape and size of metallic nanoparticles.

備註

本會(收文號1120002852)同意該校112年1月9日興產字第1124300027號函申請終止維護專利(國立中興大學)

連絡單位 (專責單位/部門名稱)

技術授權中心

連絡電話

04-22851811

網址