MEHTOD FOR FORMING LEAD-CARBON COMPOUND INTERFACE LAYER ON LEAD-BASED SUBSTRATE

專利類型

發明

專利國別 (專利申請國家)

美國

專利申請案號

16/740,934

專利證號

US 11,349,110 B2

專利獲證名稱

MEHTOD FOR FORMING LEAD-CARBON COMPOUND INTERFACE LAYER ON LEAD-BASED SUBSTRATE

專利所屬機關 (申請機關)

國立虎尾科技大學

獲證日期

2022/05/31

技術說明

We present a method for forming a lead-carbon compound interface layer on a lead-based substrate, wherein the lead-based substrate has a surface, the method comprising steps of: causing an acidic solution to contact with a carbon material and a lead-containing material to form a carbon-containing plumbate precursor having an ionic lead; and reducing the ionic lead in the carbon-containing plumbate precursor to form the lead-carbon compound interface layer on the surface.

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連絡單位 (專責單位/部門名稱)

智財技轉組

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