用以控制形成銲接界面生成物的方法

專利類型

發明

專利國別 (專利申請國家)

美國

專利申請案號

10/104,085

專利證號

US 6,602,777B1

專利獲證名稱

用以控制形成銲接界面生成物的方法

專利所屬機關 (申請機關)

國立中央大學

獲證日期

2003/08/05

技術說明

一種用以控制形成銲接界面生成物的方法，其係藉由調整錫-銀-銅銲料中銅濃度的方式， 以控制錫-銀-銅銲料與含鎳銲墊於銲接之後所形成之銲接界面生成物之種類及生長狀態。 其中，當錫-銀-銅銲料中銅的濃度大於等於0.6 wt.%時，銲接界面生成物係為(Cu1-xNix) 6Sn5。當錫-銀-銅銲料中銅的濃度小於等於0.4 wt.%時，銲接界面生成物係為(Ni1-yCuy) 3Sn4及(Cu1-xNix)6Sn5，其中(Ni1-yCuy)3Sn4為連續層，(Cu1-xNix)6Sn5為不連續層。當 錫-銀-銅銲料中銅的濃度介於0.4 wt.%至0.6 wt.%之間時，銲接界面生成物係為(Cu1- xNix)6Sn5與(Ni1-yCuy)3Sn4兩連續層。 The present invention relates to a method for controlling the formation of the intermetallic compounds in solder joints, The types of the intermetallic compounds between the SnAgCu solders and the Ni-bearing substrate can be controlled by adjusting the copper concentration in the SnAgCu solders. If the SnAgCu solder has a copper concentration higher than or equivalent to 0.6 wt.%, the soldering intermetallic compound includes a continuous (Cu1-xNix) 6Sn5 layer. If the copper concentration of the SnAgCu solders is lower than or equivalent to 0.4 wt.%, the soldering intermetallic compound includes a continuos (Ni1-yCuy)3Sn4 layer and a non-continuous (Cu1-xNix)6Sn5 layer. If the copper concentration of the SnAgCu solders is between 0.4 wt.% to 0.6 wt.%, the soldering intermetallic compound includes the continuous (Cu1-xNix) 6Sn5 layer and the continuous (Ni1-yCuy)3Sn4 layer.

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