電性連接結構及其製備方法

專利類型

發明

專利國別 (專利申請國家)

大陸

專利申請案號

201310556722.0

專利證號

2428731

專利獲證名稱

電性連接結構及其製備方法

專利所屬機關 (申請機關)

國立陽明交通大學

獲證日期

2017/03/29

技術說明

本發明係有關於一種用以電性連接一第一基板及一第二基板之電性連接結構及其製備方法，其中製備方法包括：(A) 提供一第一基板及一第二基板，其中第一基板上係設有一第一銅凸塊，第二基板上係設有一第二銅凸塊，第一銅凸塊之一第一接合面及第二銅凸塊之一第二接合面之至少一者係為一(111)面；以及(B) 將第一銅凸塊及第二銅凸塊相互接合以形成銅接點，其中第一銅凸塊之第一接合面係與於第二銅凸塊之第二接合面相互對應。 An electrical connecting element for connecting a first substrate and a second substrate and a method for manufacturing the same are disclosed. The method of the present invention comprises: (A) providing a first substrate and a second substrate, wherein a first copper bump is formed on the first substrate, a second cooper bump is formed on the second substrate, and at least one of a first connecting surface of the first substrate and a second connecting surface of the second substrate is a (111) surface; and (B) connecting the first copper bump and the second copper bump to form a copper interconnect, wherein the first connecting surface of the first substrate is faced to the second connecting surface of the second substrate.