智慧捲料整平驗證系統及其方法

專利類型

發明

專利國別 (專利申請國家)

中華民國

專利申請案號

106104146

專利證號

I 647021

專利獲證名稱

智慧捲料整平驗證系統及其方法

專利所屬機關 (申請機關)

國立清華大學

獲證日期

2019/01/11

技術說明

本發明提供一種智慧捲料整平驗證系統，其中移動之待整捲料受第二整平轉動模組滾壓整平於第一整平轉動模組與第二整平轉動模組之間。曲率感測裝置感測並輸出待整捲料之整後捲料曲率。運算處理裝置依據反應曲面法運算待整捲料厚度、待整捲料寬度及待整捲料曲率而產生模擬下壓位移量，且運算處理裝置依據模擬下壓位移量提供回饋控制機制，優化第二整平轉動模組之下壓位移量對應到模擬下壓位移量。因此，本發明利用雲端伺服器配合故障診斷裝置藉由即時回饋控制方式進行整平裝置的調整，以實現智慧整平驗證之效。 An intelligent coil leveling validating system and validating method thereof includes a platform, a leveling device, a curvature measuring device and a processor. The leveling device and the curvature measuring device are disposed on the platform. The leveling device includes a first leveling module and a second leveling module. A coil is moved between the first leveling module and the second leveling module. The coil has a first curvature before leveling and a second curvature after leveling. The curvature measuring device measures the second curvature. The processor computes a thickness, a width and the first curvature to produce a simulated moving distance of the second leveling module by a response surface method. In addition, the processor provides a feedback control to optimize a practical moving distance of the second leveling module via the simulated moving distance.

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