雷射微加工狀態診斷系統

專利類型

發明

專利國別 (專利申請國家)

中華民國

專利申請案號

102101446

專利證號

I 532557

專利獲證名稱

雷射微加工狀態診斷系統

專利所屬機關 (申請機關)

國立雲林科技大學

獲證日期

2016/05/11

技術說明

本發明之目的在於提供一種雷射微加工狀態診斷系統，其兼具可推算可檢測加工穿孔、檢測加工深度及檢測雷射聚焦位置等優點及功效，用以解決習知技術孔深計算易有誤差之問題。利用視訊攝影機來擷取電漿生成過程中的動態影像，並針對影像中的時域、頻域訊號，進行機器視覺的狀態分析，對雷射微加工的深度狀態進行預測，分析電漿生成時的訊號特徵與加工孔深之間的對應關係，並透過實驗觀察及量測之結果，發展可即時回饋訊號來調控脈衝雷射方式，達到通孔、盲孔的加工要求，解決一般雷射加工過程中無法即時感知加工深度的問題。 The system is based on visual monitoring of the working surface using a digital camera, coupled with microcontroller control of the drilling laser operation. Two electrodes were placed in the middle space of the workpiece, and the induced current can be detected when electrons are rapidly propelled during the plasma expansion. A photograph of the target plasma was taken using a digital camera with the triggering signal by the induced current. The camera is installed adjacent to the entry surface of the workpiece, and the spatial extend of the laser-induced plasma at the working site is monitored as the criterion for breakthrough detection. The acquired visual signal for drilling could also be used as an input for a blind hole depth process control scheme. Experimental results will be conducted to show that the proposed system successfully detects when the laser beam has broken through a workpiece, and turns off the laser automatically by feedback control.

備註

本部(發文號1090014096)同意貴校109年3月5日雲科大研字第1090014096號函申請讓與至發明人現行學校(北科大)。

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