以多層基板結構散熱之LED燈具LED lamp instantly dissipating heat as effected by multiple-layer substrates

專利類型

發明

專利國別 (專利申請國家)

美國

專利申請案號

11/880,372

專利證號

US 7,607,802 B2

專利獲證名稱

以多層基板結構散熱之LED燈具LED lamp instantly dissipating heat as effected by multiple-layer substrates

專利所屬機關 (申請機關)

淡江大學學校財團法人淡江大學

獲證日期

2009/10/27

技術說明

一種以多層基板結構散熱之LED燈具，係令多數LED分別安裝於多數基板(substrate)上，能將LED所產生之廢熱採分散、分層以增加散熱面積之方式散熱，有別於一般設計將LED(focus)建置在同一塊基板上，造成熱源集中散熱不易之缺點。 本發明係令各該基板直接原位(in-situ)形成散熱片俾瞬即將LED所生之熱散除者；並包括：一散熱裝置(heat sink & heat pipe)連接或安裝於至少一基板上，以增益LED之散熱效果，以免劣化其照明品質者。 The object of the present invention is to provide a LED lamp including: a plurality of substrates juxtapositioned as multiple layers, each substrate having a plurality of light emitting diodes (LEDs) mounted thereon, whereby upon generation of heat by the LEDs, each substrate will form as a heat-dissipating plate in-situ in order that the multiple-layer substrates will instantly effectively dissipate the heat from the LEDs of the lamp outwardly for preventing deterioration of the illumination quality of the LED lamp.

備註

106-02研發成果審查會同意終止維護專利

連絡單位 (專責單位/部門名稱)

研究發展處

連絡電話

26215656分機2561

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