一種結合凱文與花環複合結構用於精密觀測銲錫凸塊接點之電阻變化

專利類型

發明

專利國別 (專利申請國家)

大陸

專利申請案號

201110208532.0

專利證號

1697852

專利獲證名稱

一種結合凱文與花環複合結構用於精密觀測銲錫凸塊接點之電阻變化

專利所屬機關 (申請機關)

國立交通大學

獲證日期

2014/06/01

技術說明

本發明係有關於一種凸塊接點之電阻測量結構以及包含該結構之封裝基板，該電阻測量結構包括：複數個連接凸塊，係排列呈一線﹔至少一第一連接墊﹔以及至少一第二連接墊﹔其中，該複數個連接凸塊中之第n個連接凸塊與第n+1個連接凸塊係以該第一連接墊電性連接，該第n+1個連接凸塊與第n+2個連接凸塊係以該第二連接墊電性連接，n係為1以上之奇數﹔該第一連接墊係與一第一電壓量測墊連接﹔該第二連接墊係與一輔助連接墊連接，該輔助連接墊係與一輔助凸塊(auxiliary bump)連接，一第二電壓量測墊係連接至該輔助凸塊。 A structure for measuring bump resistance and package substrate comprising the same are disclosed, the structure for measuring bump resistance comprises: plural connecting bumps arranged in a row; at least one first connecting pad; and at least one second connecting pad; wherein the nth connecting bump and the (n+1)th connecting bump connect by the first connecting pad, the (n+1)th connecting bump and the (n+2)th connecting bump connect by the second connecting pad, n is an odd number of 1 or more; the first connecting pad connects with a first voltage-measurement pad; the second connecting pad connects with an auxiliary pad, the auxiliary pad connects with an auxiliary bump, a second voltage-measurement pad connects with the auxiliary bump.

備註

本部(收文號1100065219)同意該校110年10月27日陽明交大研產學字第1100036963號函申請終止維護專利(陽明交大)

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