光敏性導電組成物

專利類型

發明

專利國別 (專利申請國家)

中華民國

專利申請案號

109147192

專利證號

I 765508

專利獲證名稱

光敏性導電組成物

專利所屬機關 (申請機關)

國立中山大學

獲證日期

2022/05/21

技術說明

一種光敏性導電組成物，包含導電性材料、溶劑、光敏劑、流平劑，及光聚合性組分。該光聚合性組分包括具有酸酯基及數量為4至10的伸乙氧基的反應單體、黏結劑及光起始劑。該酸酯基選自於丙烯酸酯基或甲基丙烯酸酯基，該黏結劑與該反應單體的重量比值範圍為大於0.975且3.17以下。透過該反應單體並調整該黏結劑與該反應單體的重量比值，由本發明光敏性導電組成物所形成的導電線具有高解析度的優點，且該導電線的線寬與預定的線寬間差異小，致使外擴現象得以被降低而具有低外擴率的優點，從而減少相間隔的導電線因外擴現象導致互相連接而造成短路的問題。 A photosensitive conductive composition comprises a conductive material, a solvent, a photosensitizer, a leveling agent, and a photopolymerizable component. The photopolymerizable component includes a reactive monomer which has an ester group and 4 to 10 ethyleneoxy groups, a binder and a photoinitiator. The ester group is selected from an acrylate group or methacrylate group. The weight ratio of the binder to the reactive monomer is present in an amount of greater than 0.975 and not greater than 3.17. By adjusting the weight ratio of the binder and the reactive monomer, the conductive lines which were formed by the photosensitive conductive composition of the present invention have the advantage of high resolution, and the line width of the conductive lines have small differences with a predetermined line width, so as that an expansion phenomenon is reduced and therefore an expansion ratio is low, and the problem of short circuit caused by the interconnection of the conductive lines due to the expansion phenomenon is avoided.

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