蝕刻深度量測方法及其裝置

專利類型

發明

專利國別 (專利申請國家)

中華民國

專利申請案號

100117206

專利證號

I 452644

專利獲證名稱

蝕刻深度量測方法及其裝置

專利所屬機關 (申請機關)

國立雲林科技大學

獲證日期

2014/09/11

技術說明

一種蝕刻深度量測方法及其裝置，準備一量測裝置，該量測裝置設有一光纖、一量測頭及一訊號處理組，該量測頭與該傳輸線相連接且設有一保護殼及一共光程干涉儀，將一待蝕刻基材浸泡於一蝕刻液中，將該量測頭插入該蝕刻液中，使光源經該共光程干涉儀射入該待蝕刻基材的表面並反射回該共光程干涉儀中，讓該共光程干涉儀接收所產生的干涉條紋訊號，由該訊號處理組進行訊號處理，可得到干涉條紋的分佈，再由該干涉條紋的分佈變化可推算該共光程干涉儀感測頭與該待蝕刻基材表面的間距變化，提供一可抗環境干擾、高解析度且直接量測的蝕刻深度量測方法及其裝置。 This invention is concerned with the measurement method and apparatus for measuring etching depth. The system includes a fiber, a measuring head and a signal processing module. A common optical path interferometer is embedded in the measuring head. And the measuring head is connected with the signal transmission line and arranged in the protection box. The etching structure and the measuring head are placed in the etchant. The light source passes through the interferometer and reflects at the structure. The interference signal is acquired by the signal processing module. By analyzing the distribution of the interference fringes, the variation of the gap between the structure and the measuring head can be determined. For etching depth measurement, a measuring method with the characteristics of anti-environmental disturbances, high resolution and direct measurement can be realized by the proposed invention.

備註

本部(發文號1090014096)同意貴校109年3月5日雲科大研字第1090014096號函申請終止維護專利。

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