具多層介金屬層的銲點結構SOLDER JOINT WITH A MULTILAYER INTERMETALLIC COMPOUND STRUCTURE

專利類型

發明

專利國別 (專利申請國家)

美國

專利申請案號

13/778,160

專利證號

US 9,079,272 B2

專利獲證名稱

具多層介金屬層的銲點結構SOLDER JOINT WITH A MULTILAYER INTERMETALLIC COMPOUND STRUCTURE

專利所屬機關 (申請機關)

元智大學

獲證日期

2015/07/14

技術說明

一種具多層介金屬層的銲點結構，包括銅銲墊、含錫銲料、第一介金屬層、第二介金屬層以及第三介金屬層。含錫銲料與銅銲墊相對配置。第一介金屬層配置於銅銲墊與含錫銲料之間。第一介金屬層為Cu3Sn層。第二介金屬層配置於第一介金屬層與含錫銲料之間。第二介金屬層為(Cu1-x1-y1Nix1Pdy1)6Sn5層，其中x1介於0至0.15之間，y1介於0至0.02之間。第三介金屬層配置於第二介金屬層與含錫銲料之間。第三介金屬層為(Cu1-x2-y2Nix2Pdy2)6Sn5層，其中x2介於0至0.4之間，y2介於0至0.02之間。此外，在第二介金屬層及第三介金屬層間另可配置含有Ni2SnP與Ni3P的混合介金屬層。 A solder joint with a multilayer intermetallic compound (IMC) at the solder/pad interface is provided. This joint structure includes a Cu pad, Sn-containing solder, a first IMC layer, a second IMC layer and a third IMC layer. The Cu pad is disposed opposite to the Sn-containing solder. The first IMC layer is disposed between the Cu pad and the Sn-containing solder. The first IMC layer is a Cu3Sn layer. The second IMC layer is disposed between the first IMC layer and the Sn-containing solder. The second IMC layer is a (Cu1-x1-y1Nix1Pdy1)6Sn5 layer, wherein x1 is in the range between 0 and 0.15, and y1 is in the range between 0 and 0.02. The third IMC layer is disposed between the second IMC layer and the Sn-containing solder. The third IMC layer is a (Cu1-x2-y2Nix2Pdy2)6Sn5 layer, wherein x2 is in the range between 0 and 0.4, and y2 is in the range between 0 and 0.02.

備註

本部(發文號1080053907)同意該校108年8月5日元智研字第1080000805號函申請終止維護專利。

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