音射探頭及其壓電材料與音阻抗匹配層的結合方法ACCOUSTIC EMISSION SENSOR PROBE AND METHOD FOR COMBINATION OF PIEZOELECTRIC MATERIALS OF ACOUSTIC EMISSION PROBE AND ACOUSTIC IMPEDANCE MATCHING LAYER

專利類型

發明

專利國別 (專利申請國家)

中華民國

專利申請案號

101131432

專利證號

I 472760

專利獲證名稱

音射探頭及其壓電材料與音阻抗匹配層的結合方法ACCOUSTIC EMISSION SENSOR PROBE AND METHOD FOR COMBINATION OF PIEZOELECTRIC MATERIALS OF ACOUSTIC EMISSION PROBE AND ACOUSTIC IMPEDANCE MATCHING LAYER

專利所屬機關 (申請機關)

國立成功大學

獲證日期

2015/02/11

技術說明

本發明係有關於一種音射探頭及其壓電材料與音阻抗匹配層的結合方法，係將至少一經極化後的壓電材料結合於音阻抗匹配層上，結合時是先將音阻抗匹配層加熱至一預設溫度，並將銲料置於音阻抗匹配層上，使之受熱而熔融，待將壓電材料置於其上後，便能使極化後之壓電材料密貼結合於音阻抗匹配層上；而透過此種結合方式，能避免經極化後之壓電材料的電子排列錯亂，進而提升音射探頭之偵測靈敏度。最後達成以最低的成本與最簡單的製作程序，完成最靈敏的音射探頭。 The present invention relates to an acoustic emission (AE) sensor probe and a method for combination of piezoelectric materials of the AE probe and an acoustic impedance matching layer, especially to the method for combining at least one polarized piezoelectric materials to an acoustic impedance matching layer, comprising the following steps: stacking a plurality of polarized piezoelectric materials on one another by adhesive, heating an acoustic impedance matching layer up to a preset temperature and at last placing a welding material on the acoustic impedance matching layer for being heated and melted, so as further to place the polarized piezoelectric materials in a stacked state on the acoustic impedance matching layer. The polarized piezoelectric materials can be closely combined with the acoustic impedance matching layer to avoid the disorder of electrons on the polarized piezoelectric materials and further to increase the detecting sensitivity of the AE sensor probe.

備註

本部(收文號1090031211)同意該校109年5月29日成大技轉字第1095600304號函申請終止維護專利(成大)

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